TI thermal compression ball-bonder

TI thermal compression ball-bonder

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Location
Currently not on view
Object Name
Bonder, Thermal Compression Ball
circuit assembly tool
ball, compression, bonder-thermal
Other Terms
Bonder, Thermal Compression Ball; Solid State; Microelectronics
maker
Texas Instruments
Measurements
overall: 27 in x 34 in x 22 in; 68.58 cm x 86.36 cm x 55.88 cm
ID Number
1987.0487.435
collector/donor number
G00276
catalog number
1987.0487.435
accession number
1987.0487
Credit Line
from Texas Instruments
See more items in
Work and Industry: Electricity
Data Source
National Museum of American History
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